X
    學術可視化工作室RC   登錄   提交文稿
學術英文編修

IEEE Transactions on Components Packaging and Manufacturing Technology

期刊標題檢索 IEEE T COMP PAC 最新評論: The submission is still under review after four months. (2024-11-18)


期刊名稱:   ISSN:   主題領域:   影響因子範圍: -
索引:   類別:   開放訪問:   排序方式:

[IEEE Transactions on Components Packaging and Manufacturing Technology]您好,您是該頁面的第 80137 位訪客。

期刊簡介
期刊名稱IEEE Transactions on Components Packaging and Manufacturing Technology IEEE Transactions on Components Packaging and Manufacturing Technology
LetPub Score
6.0
50 ratings
Rate

Reputation
6.7

Influence
5.1

Speed
7.9

期刊簡稱IEEE T COMP PACK MAN
ISSN2156-3950
h-index39
CiteScore
CiteScoreSJRSNIPCiteScore Rank
4.700.5621.119
Subject fieldQuartilesRankPercentile
Category: Engineering
Subcategory: Industrial and Manufacturing Engineering
Q2123 / 384
Category: Engineering
Subcategory: Electrical and Electronic Engineering
Q2283 / 797
Category: Engineering
Subcategory: Electronic, Optical and Magnetic Materials
Q2108 / 284

自引率 (2023-2024)13.00%自引率趨勢
掲載範囲
IEEE Transactions on Components, Packaging, and Manufacturing Technology publishes research and application articles on modeling, design, building blocks, technical infrastructure, and analysis underpinning electronic, photonic and MEMS packaging, in addition to new developments in passive components, electrical contacts and connectors, thermal management, and device reliability; as well as the manufacture of electronics parts and assemblies, with broad coverage of design, factory modeling, assembly methods, quality, product robustness, and design-for-environment.
官方網站https://www.ieee.org/membership-catalog/productdetail/showProductDetailPage.html?product=PER240-PRT
在線稿件提交
開放訪問No
出版商Institute of Electrical and Electronics Engineers Inc.
主題領域ENGINEERING, MANUFACTURING
出版國/地區UNITED STATES
發行頻率
創刊年2011
每年文章數217每年文章數趨勢
黃金OA百分比11.38%
Web of Science 四分位
2023-2024
WOS Quartile: Q2

CategoryEditionJIF QuartileJIF RankingJIF Percentage
ENGINEERING, ELECTRICAL & ELECTRONICSCIEQ2175/352
ENGINEERING, MANUFACTURINGSCIEQ341/68
MATERIALS SCIENCE, MULTIDISCIPLINARYSCIEQ3275/438
索引 (SCI or SCIE)Science Citation Index
Science Citation Index Expanded
鏈接到PubMed Central (PMC)https://www.ncbi.nlm.nih.gov/nlmcatalog?term=2156-3950%5BISSN%5D
平均審稿時間 *來自出版商的數據:
來自作者的數據: Ordinary, 3-6 Week(s)
競爭力 *來自作者的數據: Easy
參考鏈接
相關期刊 【IEEE Transactions on Components Packaging and Manufacturing Technology】CiteScore趨勢
自引率趨勢 每年文章數趨勢
作者評論
*所有的審稿過程指標,如接受率和審稿速度,僅限於用戶提交的稿件。因此,這些指標可能無法準確反映期刊的競爭力或速度。
  • 同一學科的期刊
  • CiteScore趨勢
  • 自引率趨勢
  • 每年文章數趨勢
  •  
    學科內的可信期刊 影響因子
    IEEE Transactions on Sustainable EnergyH-index: 85

    CiteScore: 21.40
    IEEE-ACM Transactions on Audio Speech and Language ProcessingH-index: 29

    CiteScore: 11.30
    IEEE AccessH-index: 56

    CiteScore: 9.80
    Journal of Real-Time Image ProcessingH-index: 27

    CiteScore: 6.80
    IEEE Design & TestH-index: 72

    CiteScore: 3.80
    AutomatikaH-index: 18

    CiteScore: 4.00
    EURASIP Journal on Audio Speech and Music ProcessingH-index: 0

    CiteScore: 4.10
    IEEE Latin America TransactionsH-index: 19

    CiteScore: 3.50
    Turkish Journal of Electrical Engineering and Computer SciencesH-index: 25

    CiteScore: 2.90
    JOURNAL OF MICROWAVE POWER AND ELECTROMAGNETIC ENERGYH-index: 30

    CiteScore: 2.50
    學科內最受檢索的期刊 頁面查看次數
    IEEE Access2894194
    IEEE Transactions on Sustainable Energy173680
    IEEE-ACM Transactions on Audio Speech and Language Processing99103
    Journal of Real-Time Image Processing82004
    Turkish Journal of Electrical Engineering and Computer Sciences57026
    Automatika48354
    IEEE Latin America Transactions39741
    IEEE Design & Test34643
    JOURNAL OF MICROWAVE POWER AND ELECTROMAGNETIC ENERGY22534
    EURASIP Journal on Audio Speech and Music Processing22438
  •  

    IEEE Transactions on Components Packaging and Manufacturing Technology IEEE Transactions on Components Packaging and Manufacturing Technology
    明年預測:
    穩步上升 無變化 逐步下降  刷新
  •  

     
  •  

     


首頁    上一頁    1    2    下一頁    末頁  (頁
/2)
  [IEEE Transactions on Components Packaging and Manufacturing Technology] 的評論撰寫評論
作者: Chemelec


領域: 材料科学
審稿時間: 4.0 month(s)
結果: 待定&不明


撰寫評論

2024-11-18 23:06:36 評論於
The submission is still under review after four months.
(0) 讚! | Chemelec

作者: qianha


領域: 工程技术
審稿時間: 0.0 month(s)
結果: 待定&不明


撰寫評論

2024-11-18 20:52:23 評論於
On November 18th, the first trial is still ongoing, and there has been no response to the request for the manuscript.
(0) 讚! | qianha

作者: qianha


領域: 工程技术
審稿時間: 0.0 month(s)
結果: 待定&不明


撰寫評論

2024-11-14 16:09:17 評論於
This is already good, I have seen two revisions for one year of review.
(0) 讚! | qianha

作者: 呀俊俊


領域: 工程技术
審稿時間: 0.0 month(s)
結果: 待定&不明


撰寫評論

2024-11-05 15:39:33 評論於
The submission made on 9.21 has been under review for almost two months......
(0) 讚! | 呀俊俊

作者: R0509


領域: 工程技术
審稿時間: 0.0 month(s)
結果: 待定&不明


撰寫評論

2024-11-05 10:49:36 評論於
As of October 21, 2024, the case is still under review and the outcome is unknown.
(0) 讚! | R0509

作者: R0509


領域: 工程技术
審稿時間: 0.0 month(s)
結果: 待定&不明


撰寫評論

2024-11-05 10:44:00 評論於
A long time ago, I was rejected, then I submitted to another journal in June. Recently, I submitted another piece to this journal, but now the journal has a new submission website.
(0) 讚! | R0509

作者: wodeweizai


領域: 工程技术
審稿時間: 0.0 month(s)
結果: 待定&不明


撰寫評論

2024-10-27 08:56:32 評論於
Submission website: https://mc.manuscriptcentral.com/ieee-tcpmt
(0) 讚! | wodeweizai

作者: Yaso


領域: 计算机科学
審稿時間: 0.0 month(s)
結果: 待定&不明


撰寫評論

2024-10-11 10:50:13 評論於
Thank you for the reply! No news is good news, also wishing the OP to accept!!!
(0) 讚! | Yaso

作者: qianha


領域: 工程技术
審稿時間: 0.0 month(s)
結果: 待定&不明


撰寫評論

2024-10-10 08:45:40 評論於
After assigning AE, it has always been UR.
(0) 讚! | qianha

作者: qianha


領域: 工程技术
審稿時間: 0.0 month(s)
結果: 待定&不明


撰寫評論

2024-10-10 08:44:18 評論於
October 10th, no response to the reminder for submission. I am on the verge of a breakdown.
(0) 讚! | qianha

作者: Yaso


領域: 计算机科学
審稿時間: 0.0 month(s)
結果: 待定&不明


撰寫評論

2024-10-09 14:54:57 評論於
I see that the articles on the official website are still stuck in August. Does this mean that no articles were accepted in September? Also, what is the status after AE UR?
(0) 讚! | Yaso

作者: qianha


領域: 工程技术
審稿時間: 0.0 month(s)
結果: 待定&不明


撰寫評論

2024-09-23 19:37:52 評論於
The deadline for submission was September 19th, but there has been no response so far.
(0) 讚! | qianha

作者: qianha


領域: 工程技术
審稿時間: 0.0 month(s)
結果: 待定&不明


撰寫評論

2024-09-17 19:49:08 評論於
Submitted on July 4th, the outcome is still unknown at this time.
(0) 讚! | qianha

作者: Terahertz_1


領域: 工程技术
審稿時間: 0.0 month(s)
結果: 待定&不明


撰寫評論

2024-07-20 01:21:32 評論於
How long is the first-instance trial scheduled for?
(0) 讚! | Terahertz_1

作者: 草葎风


領域: 工程技术
審稿時間: 0.0 month(s)
結果: 待定&不明


撰寫評論

2024-07-12 12:55:57 評論於
First round of minor revisions, will return with reviewer's comments on July 11th.
(0) 讚! | 草葎风

作者: dsawd


領域: 工程技术
審稿時間: 1.0 month(s)
結果: 修改後接受


撰寫評論

2024-06-24 21:26:07 評論於
Submitted 30 Jan 2024
Decision: Reject and Resubmit 08 Mar 2024
Resubmitted 10 Apr 2024
Accepted 28 Apr 2024
Two reviewers, one positive and one negative, accepted after major revisions.
(0) 讚! | dsawd

作者: linebarrel_nnu


領域: 工程技术
審稿時間: 0.0 month(s)
結果: 待定&不明


撰寫評論

2024-06-07 18:57:48 評論於
Hello, why is it that when I submit a manuscript, it doesn't show whether it is OA or non-OA? It doesn't remind me that it is a fee-based journal like Elsevier does. Can I please add a contact information to inquire about this?
(0) 讚! | linebarrel_nnu

作者: wodeweizai


領域: 工程技术
審稿時間: 0.0 month(s)
結果: 待定&不明


撰寫評論

2024-04-10 08:15:33 評論於
This is another updated submission website: https://ieee.atyponrex.com/submission/dashboard?siteName=ieee-tcpmt
(0) 讚! | wodeweizai

作者: material11


領域: 材料科学
審稿時間: 0.0 month(s)
結果: 待定&不明


撰寫評論

2024-04-09 22:34:18 評論於
Hello, what is the status of the external review? I am currently reviewing as an AE, what is the next stage?
(0) 讚! | material11

作者: material11


領域: 材料科学
審稿時間: 0.0 month(s)
結果: 待定&不明


撰寫評論

2024-04-09 22:32:39 評論於
Hello, what is your current status?
(0) 讚! | material11

作者: material11


領域: 材料科学
審稿時間: 0.0 month(s)
結果: 待定&不明


撰寫評論

2024-04-09 22:30:36 評論於
Hello, what is your current status? I have been waiting for half a month for my submission to be reviewed by AE, and this status has been unchanged for two weeks
(0) 讚! | material11

作者: 草葎风


領域: 工程技术
審稿時間: 0.0 month(s)
結果: 待定&不明


撰寫評論

2024-04-08 16:30:51 評論於
May I ask what your current status is?
(0) 讚! | 草葎风

作者: 草葎风


領域: 工程技术
審稿時間: 0.0 month(s)
結果: 待定&不明


撰寫評論

2024-04-08 16:28:20 評論於
07-Apr-2024
AE: Not Assigned

Under Review
(0) 讚! | 草葎风

作者: wodeweizai


領域: 工程技术
審稿時間: 0.0 month(s)
結果: 待定&不明


撰寫評論

2024-04-05 13:27:24 評論於
After searching for a while, the submission website is: 
https://mc.manuscriptcentral.com/ieee-tcpmt
(0) 讚! | wodeweizai

作者: Electronics1


領域: 计算机科学
審稿時間: 0.0 month(s)
結果: 待定&不明


撰寫評論

2024-03-18 15:30:45 評論於
It has been 10 days since submission, but still AE: Not Assigned
(0) 讚! | Electronics1

首頁    上一頁    1    2    下一頁    末頁  (頁
/2)

開始撰寫 [IEEE Transactions on Components Packaging and Manufacturing Technology] 的評論:





Contact us

Contact us  

Your name*

Your email*

Your message*

Please fill in all fields and provide a valid email.

Security Code*