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MICROELECTRONICS JOURNAL

期刊標題檢索 MICROELECTRON J 最新評論: A very good journal. (2024-11-01)


期刊名稱:   ISSN:   主題領域:   影響因子範圍: -
索引:   類別:   開放訪問:   排序方式:

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期刊簡介
期刊名稱MICROELECTRONICS JOURNAL MICROELECTRONICS JOURNAL
LetPub Score
5.8
50 ratings
Rate

Reputation
6.6

Influence
4.5

Speed
9.4

期刊簡稱MICROELECTRON J
ISSN0026-2692
E-ISSN1879-2391
h-index59
CiteScore
CiteScoreSJRSNIPCiteScore Rank
4.000.3900.854
Subject fieldQuartilesRankPercentile
Category: Physics and Astronomy
Subcategory: Condensed Matter Physics
Q2181 / 434
Category: Physics and Astronomy
Subcategory: Electrical and Electronic Engineering
Q2332 / 797
Category: Physics and Astronomy
Subcategory: Atomic and Molecular Physics, and Optics
Q2101 / 224
Category: Physics and Astronomy
Subcategory: Surfaces, Coatings and Films
Q261 / 132
Category: Physics and Astronomy
Subcategory: Electronic, Optical and Magnetic Materials
Q2133 / 284

自引率 (2023-2024)31.60%自引率趨勢
掲載範囲
Published since 1969, the Microelectronics Journal is an international forum for the dissemination of research and applications of microelectronic systems, circuits, and emerging technologies. Papers published in the Microelectronics Journal have undergone peer review to ensure originality, relevance, and timeliness. The journal thus provides a worldwide, regular, and comprehensive update on microelectronic circuits and systems.

The Microelectronics Journal invites papers describing significant research and applications in all of the areas listed below. Comprehensive review/survey papers covering recent developments will also be considered. The Microelectronics Journal covers circuits and systems. This topic includes but is not limited to: Analog, digital, mixed, and RF circuits and related design methodologies; Logic, architectural, and system level synthesis; Testing, design for testability, built-in self-test; Area, power, and thermal analysis and design; Mixed-domain simulation and design; Embedded systems; Non-von Neumann computing and related technologies and circuits; Design and test of high complexity systems integration; SoC, NoC, SIP, and NIP design and test; 3-D integration design and analysis; Emerging device technologies and circuits, such as FinFETs, SETs, spintronics, SFQ, MTJ, etc.

Application aspects such as signal and image processing including circuits for cryptography, sensors, and actuators including sensor networks, reliability and quality issues, and economic models are also welcome.
官方網站http://www.journals.elsevier.com/microelectronics-journal/
在線稿件提交https://www.editorialmanager.com/MEJ
開放訪問No
出版商Elsevier
主題領域工程技术
出版國/地區ENGLAND
發行頻率月刊
創刊年0
每年文章數293每年文章數趨勢
黃金OA百分比2.61%
Web of Science 四分位
2023-2024
WOS Quartile: Q3

CategoryEditionJIF QuartileJIF RankingJIF Percentage
ENGINEERING, ELECTRICAL & ELECTRONICSCIEQ3211/352
NANOSCIENCE & NANOTECHNOLOGYSCIEQ4110/140
索引 (SCI or SCIE)Science Citation Index Expanded
鏈接到PubMed Central (PMC)https://www.ncbi.nlm.nih.gov/nlmcatalog?term=0026-2692%5BISSN%5D
平均審稿時間 *來自出版商的數據:
來自作者的數據: About 3.0 month(s)
競爭力 *來自作者的數據: Easy
參考鏈接
相關期刊 【MICROELECTRONICS JOURNAL】CiteScore趨勢
自引率趨勢 每年文章數趨勢
作者評論
*所有的審稿過程指標,如接受率和審稿速度,僅限於用戶提交的稿件。因此,這些指標可能無法準確反映期刊的競爭力或速度。
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    學科內的可信期刊 影響因子
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    ENGINEERING APPLICATIONS OF ARTIFICIAL INTELLIGENCEH-index: 86

    CiteScore: 9.60
    學科內最受檢索的期刊 頁面查看次數
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    PATTERN RECOGNITION546324
    IEEE TRANSACTIONS ON IMAGE PROCESSING515157
    IEEE SIGNAL PROCESSING LETTERS469469
  •  

    MICROELECTRONICS JOURNAL MICROELECTRONICS JOURNAL
    明年預測:
    穩步上升 無變化 逐步下降  刷新
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  [MICROELECTRONICS JOURNAL] 的評論撰寫評論
作者: shengchengxia


領域: 计算机科学
審稿時間: 0.0 month(s)
結果: 待定&不明


撰寫評論

2024-11-01 16:42:27 評論於
A very good journal.
(0) 讚! | shengchengxia

作者: SCI追求者


領域: 材料科学
審稿時間: 3.0 month(s)
結果: 修改後接受


撰寫評論

2024-10-22 15:23:51 評論於
Great journal, the second paper has been accepted after revision!
(0) 讚! | SCI追求者

作者: 三维矩阵空间


領域: 工程技术
審稿時間: 1.0 month(s)
結果: 修改後接受


撰寫評論

2024-04-08 12:09:49 評論於
February 15th Submitted
March 11th Major Revise
April 5th Revised Manuscript Submitted
April 8th Accept
Two reviewers provided several comments and questions, which were all addressed and supplemented with experimental data in a 14-page Response. Overall, the reviewers were very professional, the editor was very responsible, and the processing speed was fast. I will consider submitting to this journal again in the future
(1) 讚! | 三维矩阵空间

作者: L11_11


領域: 工程技术
審稿時間: 0.0 month(s)
結果: 待定&不明


撰寫評論

2024-03-20 10:41:26 評論於
Hello, how fast is the review process? Is submitting a paper in three parts, including a cover letter, Manuscript File, and Declaration of Interest Statement? Do I need to submit code and programs?
(0) 讚! | L11_11

作者: lylyly123


領域: 工程技术
審稿時間: 0.0 month(s)
結果: 待定&不明


撰寫評論

2024-03-20 08:35:00 評論於
Hello, does this journal have a submission template?
(0) 讚! | lylyly123

作者: SCI追求者


領域: 材料科学
審稿時間: 2.0 month(s)
結果: 修改後接受


撰寫評論

2024-02-22 17:29:55 評論於
First time submitting, the editing process was thorough and efficient, and the reviewer's feedback was very constructive. Overall, I had a great experience with this journal!
(1) 讚! | SCI追求者

作者: 北冥有鱼


領域: 物理与天体物理
審稿時間: 1.0 month(s)
結果: 修改後接受


撰寫評論

2024-01-17 13:09:39 評論於
The review process is quick and the feedback is also very professional, highly recommended!
(0) 讚! | 北冥有鱼

作者: SCI追求者


領域: 材料科学
審稿時間: 0.0 month(s)
結果: 待定&不明


撰寫評論

2024-01-08 10:47:37 評論於
Hello. Is the "R" in your "Under Review" capitalized? I heard there is a difference even in "Under Review"
(0) 讚! | SCI追求者

作者: 小马哥


領域: 工程技术
審稿時間: 1.0 month(s)
結果: 修改後接受


撰寫評論

2023-08-31 16:14:12 評論於
I progress every 20 days, the efficiency of this journal is still very high
(0) 讚! | 小马哥

作者: 小马哥


領域: 工程技术
審稿時間: 0.0 month(s)
結果: 待定&不明


撰寫評論

2023-01-17 08:55:22 評論於
1.15 submit - Please submit.
1.16 under review - Currently being reviewed.
(0) 讚! | 小马哥

作者: wwwhd


領域: 工程技术
審稿時間: 4.0 month(s)
結果: 修改後接受


撰寫評論

2022-07-14 10:39:52 評論於
A journal with a good level in the field of microelectronics. The reviewers are very professional and raised over thirty questions in total. I supplemented the experiments for a month, which significantly improved the quality of the article. After two rounds of revisions, it was accepted for publication. The journal has a high quality and both its ranking and impact factor are expected to further improve.
(8) 讚! | wwwhd

作者: 西瓜呀


領域: 工程技术
審稿時間: 2.0 month(s)
結果: 修改後接受


撰寫評論

2020-08-02 15:09:26 評論於
Received at Editorial Office 16 Mar 2020; Major revision 5 May 2020; Article revised 1 Jul 2020; Article accepted for publication 25 Jul 2020. It took approximately six weeks from submission to the first review, a major revision was required, and the reviewer's comments are very good. It took us nearly two months to complete the revision, and about three weeks for the second review, then it was directly accepted.

(1) 讚! | 西瓜呀

作者: 匿名


領域: 信息科学
審稿時間: 0.0 month(s)
結果:


撰寫評論

2013-04-28 10:55:00 評論於
The editors are good and the reviewer’s comments are pertinent. But the review can be slow. It’s best to expect over 4-6 months for the process.

(1) 讚! | 匿名

作者: 匿名


領域: 信息科学
審稿時間: 0.0 month(s)
結果:


撰寫評論

2012-12-14 11:02:00 評論於
Editing is very powerful ah
(1) 讚! | 匿名

作者: 匿名


領域: 信息科学
審稿時間: 0.0 month(s)
結果:


撰寫評論

2012-06-29 15:55:00 評論於
好杂志
(0) 讚! | 匿名

作者: 匿名


領域: 信息科学
審稿時間: 0.0 month(s)
結果:


撰寫評論

2012-02-21 20:10:00 評論於
Review time is fixed,Two selects were sent in 3-4 months.The reviewers are very serious and the questions are very detailed.However, I feel that it is still a good journal.
(1) 讚! | 匿名

作者: 匿名


領域:
審稿時間: 0.0 month(s)
結果:


撰寫評論

2011-08-20 13:33:00 評論於
Journal Homepage URL: http://ees.elsevier.com/mej/
(0) 讚! | 匿名

作者: 匿名


領域: 工程与材料
審稿時間: 0.0 month(s)
結果:


撰寫評論

2011-08-14 13:07:00 評論於
Persistence is victory, 5 judges, tastes will not be exactly the same,Grasping the commonality and seriously responding to the comments of the judges, the editorial quality of the journal is very high, and people feel very good.
(0) 讚! | 匿名

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