期刊簡介 | |||||||||||||||||||||||||||||||||
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
期刊名稱 | MICROELECTRONICS JOURNAL LetPub Score 5.8
50 ratings
Rate
Reputation 6.6 Influence 4.5 Speed 9.4 | ||||||||||||||||||||||||||||||||
期刊簡稱 | MICROELECTRON J | ||||||||||||||||||||||||||||||||
ISSN | 0026-2692 | ||||||||||||||||||||||||||||||||
E-ISSN | 1879-2391 | ||||||||||||||||||||||||||||||||
h-index | 59 | ||||||||||||||||||||||||||||||||
CiteScore |
| ||||||||||||||||||||||||||||||||
自引率 (2023-2024) | 31.60%自引率趨勢 | ||||||||||||||||||||||||||||||||
掲載範囲 |
| ||||||||||||||||||||||||||||||||
官方網站 | http://www.journals.elsevier.com/microelectronics-journal/ | ||||||||||||||||||||||||||||||||
在線稿件提交 | https://www.editorialmanager.com/MEJ | ||||||||||||||||||||||||||||||||
開放訪問 | No | ||||||||||||||||||||||||||||||||
出版商 | Elsevier | ||||||||||||||||||||||||||||||||
主題領域 | 工程技术 | ||||||||||||||||||||||||||||||||
出版國/地區 | ENGLAND | ||||||||||||||||||||||||||||||||
發行頻率 | 月刊 | ||||||||||||||||||||||||||||||||
創刊年 | 0 | ||||||||||||||||||||||||||||||||
每年文章數 | 293每年文章數趨勢 | ||||||||||||||||||||||||||||||||
黃金OA百分比 | 2.61% | ||||||||||||||||||||||||||||||||
Web of Science 四分位 ( 2023-2024) | WOS Quartile: Q3
| ||||||||||||||||||||||||||||||||
索引 (SCI or SCIE) | Science Citation Index Expanded | ||||||||||||||||||||||||||||||||
鏈接到PubMed Central (PMC) | https://www.ncbi.nlm.nih.gov/nlmcatalog?term=0026-2692%5BISSN%5D | ||||||||||||||||||||||||||||||||
平均審稿時間 * | 來自出版商的數據: 來自作者的數據: About 3.0 month(s) | ||||||||||||||||||||||||||||||||
競爭力 * | 來自作者的數據: Easy | ||||||||||||||||||||||||||||||||
參考鏈接 |
| ||||||||||||||||||||||||||||||||
*所有的審稿過程指標,如接受率和審稿速度,僅限於用戶提交的稿件。因此,這些指標可能無法準確反映期刊的競爭力或速度。 |
首頁 上一頁 1 下一頁 末頁 (頁 | |
[MICROELECTRONICS JOURNAL] 的評論 | 撰寫評論 |
作者: 三维矩阵空间 領域: 工程技术 審稿時間: 1.0 month(s) 結果: 修改後接受 撰寫評論 |
2024-04-08 12:09:49 評論於 February 15th Submitted March 11th Major Revise April 5th Revised Manuscript Submitted April 8th Accept Two reviewers provided several comments and questions, which were all addressed and supplemented with experimental data in a 14-page Response. Overall, the reviewers were very professional, the editor was very responsible, and the processing speed was fast. I will consider submitting to this journal again in the future(1) 讚! | 三维矩阵空间 |
作者: L11_11 領域: 工程技术 審稿時間: 0.0 month(s) 結果: 待定&不明 撰寫評論 |
2024-03-20 10:41:26 評論於 Hello, how fast is the review process? Is submitting a paper in three parts, including a cover letter, Manuscript File, and Declaration of Interest Statement? Do I need to submit code and programs?(0) 讚! | L11_11 |
作者: lylyly123 領域: 工程技术 審稿時間: 0.0 month(s) 結果: 待定&不明 撰寫評論 |
2024-03-20 08:35:00 評論於 Hello, does this journal have a submission template?(0) 讚! | lylyly123 |
作者: SCI追求者 領域: 材料科学 審稿時間: 2.0 month(s) 結果: 修改後接受 撰寫評論 |
2024-02-22 17:29:55 評論於 First time submitting, the editing process was thorough and efficient, and the reviewer's feedback was very constructive. Overall, I had a great experience with this journal!(1) 讚! | SCI追求者 |
作者: 北冥有鱼 領域: 物理与天体物理 審稿時間: 1.0 month(s) 結果: 修改後接受 撰寫評論 |
2024-01-17 13:09:39 評論於 The review process is quick and the feedback is also very professional, highly recommended!(0) 讚! | 北冥有鱼 |
作者: SCI追求者 領域: 材料科学 審稿時間: 0.0 month(s) 結果: 待定&不明 撰寫評論 |
2024-01-08 10:47:37 評論於 Hello. Is the "R" in your "Under Review" capitalized? I heard there is a difference even in "Under Review"(0) 讚! | SCI追求者 |
作者: 小马哥 領域: 工程技术 審稿時間: 1.0 month(s) 結果: 修改後接受 撰寫評論 |
2023-08-31 16:14:12 評論於 I progress every 20 days, the efficiency of this journal is still very high(0) 讚! | 小马哥 |
作者: 小马哥 領域: 工程技术 審稿時間: 0.0 month(s) 結果: 待定&不明 撰寫評論 |
2023-01-17 08:55:22 評論於 1.15 submit - Please submit. 1.16 under review - Currently being reviewed.(0) 讚! | 小马哥 |
作者: wwwhd 領域: 工程技术 審稿時間: 4.0 month(s) 結果: 修改後接受 撰寫評論 |
2022-07-14 10:39:52 評論於 A journal with a good level in the field of microelectronics. The reviewers are very professional and raised over thirty questions in total. I supplemented the experiments for a month, which significantly improved the quality of the article. After two rounds of revisions, it was accepted for publication. The journal has a high quality and both its ranking and impact factor are expected to further improve.(8) 讚! | wwwhd |
作者: 西瓜呀 領域: 工程技术 審稿時間: 2.0 month(s) 結果: 修改後接受 撰寫評論 |
2020-08-02 15:09:26 評論於 Received at Editorial Office 16 Mar 2020; Major revision 5 May 2020; Article revised 1 Jul 2020; Article accepted for publication 25 Jul 2020. It took approximately six weeks from submission to the first review, a major revision was required, and the reviewer's comments are very good. It took us nearly two months to complete the revision, and about three weeks for the second review, then it was directly accepted. (1) 讚! | 西瓜呀 |
作者: 匿名 領域: 信息科学 審稿時間: 0.0 month(s) 結果: 撰寫評論 |
2013-04-28 10:55:00 評論於 The editors are good and the reviewer’s comments are pertinent. But the review can be slow. It’s best to expect over 4-6 months for the process. (1) 讚! | 匿名 |
作者: 匿名 領域: 信息科学 審稿時間: 0.0 month(s) 結果: 撰寫評論 |
2012-12-14 11:02:00 評論於 Editing is very powerful ah(1) 讚! | 匿名 |
作者: 匿名 領域: 信息科学 審稿時間: 0.0 month(s) 結果: 撰寫評論 |
2012-06-29 15:55:00 評論於 好杂志(0) 讚! | 匿名 |
作者: 匿名 領域: 信息科学 審稿時間: 0.0 month(s) 結果: 撰寫評論 |
2012-02-21 20:10:00 評論於 Review time is fixed,Two selects were sent in 3-4 months.The reviewers are very serious and the questions are very detailed.However, I feel that it is still a good journal.(1) 讚! | 匿名 |
作者: 匿名 領域: 審稿時間: 0.0 month(s) 結果: 撰寫評論 |
2011-08-20 13:33:00 評論於 Journal Homepage URL: http://ees.elsevier.com/mej/(0) 讚! | 匿名 |
作者: 匿名 領域: 工程与材料 審稿時間: 0.0 month(s) 結果: 撰寫評論 |
2011-08-14 13:07:00 評論於 Persistence is victory, 5 judges, tastes will not be exactly the same,Grasping the commonality and seriously responding to the comments of the judges, the editorial quality of the journal is very high, and people feel very good.(0) 讚! | 匿名 |
首頁 上一頁 1 下一頁 末頁 (頁 |
Contact us