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IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY

期刊標題檢索 IEEE T ELECTROM 最新評論: 2022.7.20 Submission 2022.8.31 Major revision 2022.10.6 Revisio... (2024-05-22)


期刊名稱:   ISSN:   主題領域:   影響因子範圍: -
索引:   類別:   開放訪問:   排序方式:

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期刊簡介
期刊名稱IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY
LetPub Score
5.7
50 ratings
Rate

Reputation
6.5

Influence
4.5

Speed
8.1

期刊簡稱IEEE T ELECTROMAGN C
ISSN0018-9375
h-index82
CiteScore
CiteScoreSJRSNIPCiteScore Rank
4.800.8861.148
Subject fieldQuartilesRankPercentile
Category: Physics and Astronomy
Subcategory: Condensed Matter Physics
Q2146 / 434
Category: Physics and Astronomy
Subcategory: Electrical and Electronic Engineering
Q2276 / 797
Category: Physics and Astronomy
Subcategory: Atomic and Molecular Physics, and Optics
Q278 / 224

自引率 (2023-2024)25.00%自引率趨勢
掲載範囲
IEEE Transactions on Electromagnetic Compatibility publishes original and significant contributions related to all disciplines of electromagnetic compatibility (EMC) and relevant methods to predict, assess and prevent electromagnetic interference (EMI) and increase device/product immunity. The scope of the publication includes, but is not limited to Electromagnetic Environments; Interference Control; EMC and EMI Modeling; High Power Electromagnetics; EMC Standards, Methods of EMC Measurements; Computational Electromagnetics and Signal and Power Integrity, as applied or directly related to Electromagnetic Compatibility problems; Transmission Lines; Electrostatic Discharge and Lightning Effects; EMC in Wireless and Optical Technologies; EMC in Printed Circuit Board and System Design.
官方網站http://ieeexplore.ieee.org/xpl/RecentIssue.jsp?punumber=15
在線稿件提交http://mc.manuscriptcentral.com/temc-ieee
開放訪問No
出版商Institute of Electrical and Electronics Engineers Inc.
主題領域工程技术
出版國/地區UNITED STATES
發行頻率四半期刊行
創刊年0
每年文章數221每年文章數趨勢
黃金OA百分比8.73%
Web of Science 四分位
2023-2024
WOS Quartile: Q3

CategoryEditionJIF QuartileJIF RankingJIF Percentage
ENGINEERING, ELECTRICAL & ELECTRONICSCIEQ3202/352
TELECOMMUNICATIONSSCIEQ375/119
索引 (SCI or SCIE)Science Citation Index
Science Citation Index Expanded
鏈接到PubMed Central (PMC)https://www.ncbi.nlm.nih.gov/nlmcatalog?term=0018-9375%5BISSN%5D
平均審稿時間 *來自出版商的數據:
來自作者的數據: About 2.0 month(s)
競爭力 *來自作者的數據: Easy
參考鏈接
相關期刊 【IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY】CiteScore趨勢
自引率趨勢 每年文章數趨勢
作者評論
*所有的審稿過程指標,如接受率和審稿速度,僅限於用戶提交的稿件。因此,這些指標可能無法準確反映期刊的競爭力或速度。
  • 同一學科的期刊
  • CiteScore趨勢
  • 自引率趨勢
  • 每年文章數趨勢
  •  
    學科內的可信期刊 影響因子
    IEEE JOURNAL ON SELECTED AREAS IN COMMUNICATIONSH-index: 211

    CiteScore: 30.00
    IEEE WIRELESS COMMUNICATIONSH-index: 139

    CiteScore: 24.20
    IEEE TRANSACTIONS ON WIRELESS COMMUNICATIONSH-index: 186

    CiteScore: 18.60
    IEEE TRANSACTIONS ON MULTIMEDIAH-index: 108

    CiteScore: 11.70
    IEEE COMMUNICATIONS MAGAZINEH-index: 213

    CiteScore: 19.80
    IEEE TRANSACTIONS ON MOBILE COMPUTINGH-index: 122

    CiteScore: 12.90
    IEEE TRANSACTIONS ON COMMUNICATIONSH-index: 188

    CiteScore: 16.10
    IEEE NETWORKH-index: 111

    CiteScore: 20.40
    IEEE TRANSACTIONS ON VEHICULAR TECHNOLOGYH-index: 146

    CiteScore: 13.00
    Progress in Electromagnetics Research-PIERH-index: 80

    CiteScore: 9.00
    學科內最受檢索的期刊 頁面查看次數
    IEEE TRANSACTIONS ON VEHICULAR TECHNOLOGY524671
    IEEE TRANSACTIONS ON MULTIMEDIA428703
    IEEE COMMUNICATIONS LETTERS298203
    IEEE Systems Journal258770
    IEEE TRANSACTIONS ON COMMUNICATIONS244980
    IEEE TRANSACTIONS ON ANTENNAS AND PROPAGATION237824
    IEEE TRANSACTIONS ON AEROSPACE AND ELECTRONIC SYSTEMS224352
    IEEE TRANSACTIONS ON WIRELESS COMMUNICATIONS204415
    IEEE Antennas and Wireless Propagation Letters195860
    COMPUTER COMMUNICATIONS171290
  •  

    IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY
    明年預測:
    穩步上升 無變化 逐步下降  刷新
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  [IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY] 的評論撰寫評論
作者: 张丹枫


領域: 工程技术
審稿時間: 2.0 month(s)
結果: 修改後接受


撰寫評論

2024-05-22 16:31:05 評論於
2022.7.20 Submission
2022.8.31 Major revision
2022.10.6 Revision
2023.1.9 Major revision
2023.3.8 Revision
2023.4.19 Acceptance
(0) 讚! | 张丹枫

作者: 铁卒


領域: 工程技术
審稿時間: 3.0 month(s)
結果: 修改後接受


撰寫評論

2024-05-19 19:47:20 評論於
2023.8.30 Submission
2023.11.23 Major revision
2024.1.3 Minor revision
2024.3.11 Major revision (First reviewer has approved; Second reviewer for initial review has been replaced, may not have been contacted; Third reviewer has provided some comments, mostly suggesting revisions)
2024.3.30 Minor revision
2024.5.17 Accepted
The "awaiting EIC decision" during acceptance may take longer than during major revision, possibly due to the need to apply for a DOI number, final plagiarism check, etc. However, this is not absolute and still depends on the Editor-in-Chief's schedule
(0) 讚! | 铁卒

作者: 稗草籽


領域: 工程技术
審稿時間: 0.0 month(s)
結果: 待定&不明


撰寫評論

2024-04-30 22:32:47 評論於
Hey, how's your progress on this? Is this journal difficult, and are you moving quickly?
(0) 讚! | 稗草籽

作者: Joie


領域: 工程技术
審稿時間: 0.0 month(s)
結果: 待定&不明


撰寫評論

2023-01-15 00:23:10 評論於
Do you have a specific timeline?
(0) 讚! | Joie

作者: Neron


領域: 工程技术
審稿時間: 5.0 month(s)
結果: 修改後接受


撰寫評論

2020-12-20 21:37:12 評論於
2020.7.16 submission; 2020.8.28 a major revision was required in first review. There were three reviewers, and more than 50 comments; 2020.09.17 the revision was submitted, and there were about 20 pages for the response to the comments; 2020.10.24 a minor revision was required in the second review. One reviewer raised three more comments, and AE made some comments; 2020.11.05 after revision, it was resubmitted; 2020.12.19 Accept.

(1) 讚! | Neron

作者: kevin91


領域: 工程技术
審稿時間: 2.0 month(s)
結果: 待定&不明


撰寫評論

2020-06-20 21:36:20 評論於
Electromagnetic compatibility is now getting more and more attention, and it is a bit popular. I wrote an article on electromagnetic compatibility prediction for integrated circuits, and intended to submit to IEEE Transactions on Electron Devices. However, I found that that impact factor of IEEE Transactions on Electromagnetic Compatibility has risen, and it was in Q2 in new district of 2020. The prospects are promising, so I submitted the article and I was waiting for the review results.

(26) 讚! | kevin91

作者: fspringer


領域: 工程技术
審稿時間: 12.0 month(s)
結果: 修改後接受


撰寫評論

2019-02-11 15:44:08 評論於
Top journal in the field of EMC, very difficult. Several papers have been submitted.There was a paper, and the assistant editor gave me a chance to overhaul.

(1) 讚! | fspringer

作者: 匿名


領域: 数理科学
審稿時間: 0.0 month(s)
結果:


撰寫評論

2012-08-14 16:35:00 評論於
I am this yearThe manuscript submitted on June 3, received a reply from the editor on June 22, and the reply was received directly.The type of my submission is letter, which takes 19 days.This article is a work and communication author.The article is currently searchable on the IEEE.
(0) 讚! | 匿名

作者: 匿名


領域: 信息科学
審稿時間: 0.0 month(s)
結果: 修改後接受


撰寫評論

2011-10-19 19:04:00 評論於
is a special issue, and one at the same time, one for one, and now it is acceptd.Look at the situation is about two months or so the results do not know why he is different from others; like IEEE TED is reject, reject with major revision, accept with minor revision, accept as it is, and IEEE TEMC is condictionally accept with major revision, conditionally accept with minor revision
(0) 讚! | 匿名

作者: 匿名


領域:
審稿時間: 0.0 month(s)
結果:


撰寫評論

2011-08-19 14:55:00 評論於
Journal Homepage URL: http://ieeexplore.ieee.org/xpl/RecentIssue.jsp?punumber=15
(0) 讚! | 匿名

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