X
    學術可視化工作室RC   登錄   提交文稿
學術英文編修

COLLOIDS AND SURFACES A-PHYSICOCHEMICAL AND ENGINEERING ASPECTS

期刊標題檢索 COLLOID SURFACE 最新評論: 4.9 sub 4.11 under review Invitation 2 4.15 Accept review 1 C... (2024-06-17)


期刊名稱:   ISSN:   主題領域:   影響因子範圍: -
索引:   類別:   開放訪問:   排序方式:

[COLLOIDS AND SURFACES A-PHYSICOCHEMICAL AND ENGINEERING ASPECTS]您好,您是該頁面的第 715880 位訪客。

期刊簡介
期刊名稱COLLOIDS AND SURFACES A-PHYSICOCHEMICAL AND ENGINEERING ASPECTS COLLOIDS AND SURFACES A-PHYSICOCHEMICAL AND ENGINEERING ASPECTS
LetPub Score
8.2
67 ratings
Rate

Reputation
8.2

Influence
7.7

Speed
8.3

期刊簡稱COLLOID SURFACE A
ISSN0927-7757
E-ISSN1873-4359
h-index149
CiteScore
CiteScoreSJRSNIPCiteScore Rank
8.700.8600.923
Subject fieldQuartilesRankPercentile
Category: Chemistry
Subcategory: Physical and Theoretical Chemistry
Q131 / 189
Category: Chemistry
Subcategory: Surfaces and Interfaces
Q111 / 57
Category: Chemistry
Subcategory: Colloid and Surface Chemistry
Q28 / 21

自引率 (2023-2024)6.10%自引率趨勢
掲載範囲
Colloids and Surfaces A: Physicochemical and Engineering Aspects is an international journal devoted to the science underlying applications of colloids and interfacial phenomena.

The journal aims at publishing high quality research papers featuring new materials or new insights into the role of colloid and interface science in (for example) food, energy, minerals processing, pharmaceuticals or the environment.
官方網站https://www.journals.elsevier.com/colloids-and-surfaces-a-physicochemical-and-engineering-aspects
在線稿件提交https://www.editorialmanager.com/COLSUA
開放訪問No
出版商Elsevier
主題領域化学
出版國/地區NETHERLANDS
發行頻率月2回刊行
創刊年1993
每年文章數1874每年文章數趨勢
黃金OA百分比5.50%
Web of Science 四分位
2023-2024
WOS Quartile: Q2

CategoryEditionJIF QuartileJIF RankingJIF Percentage
CHEMISTRY, PHYSICALSCIEQ262/178
索引 (SCI or SCIE)Science Citation Index
Science Citation Index Expanded
鏈接到PubMed Central (PMC)https://www.ncbi.nlm.nih.gov/nlmcatalog?term=0927-7757%5BISSN%5D
平均審稿時間 *來自出版商的數據:
來自作者的數據: About 3.0 month(s)
來自Elsevier的數據: Average 7.7 Week(s)
競爭力 *來自作者的數據: 94%
來自Elsevier的數據: 37%
在線文章發布時間來自Elsevier的數據: Average 4 Week(s)
參考鏈接
相關期刊 【COLLOIDS AND SURFACES A-PHYSICOCHEMICAL AND ENGINEERING ASPECTS】CiteScore趨勢
自引率趨勢 每年文章數趨勢
作者評論
*所有的審稿過程指標,如接受率和審稿速度,僅限於用戶提交的稿件。因此,這些指標可能無法準確反映期刊的競爭力或速度。
  • 同一學科的期刊
  • CiteScore趨勢
  • 自引率趨勢
  • 每年文章數趨勢
  •  
    學科內的可信期刊 影響因子
    ADVANCES IN COLLOID AND INTERFACE SCIENCEH-index: 156

    CiteScore: 28.50
    JOURNAL OF PHOTOCHEMISTRY AND PHOTOBIOLOGY C-PHOTOCHEMISTRY REVIEWSH-index: 80

    CiteScore: 21.90
    Annual Review of Physical ChemistryH-index: 151

    CiteScore: 28.00
    ACTA PHYSICO-CHIMICA SINICAH-index: 31

    CiteScore: 16.60
    JOURNAL OF COLLOID AND INTERFACE SCIENCEH-index: 209

    CiteScore: 16.10
    CATALYSIS REVIEWS-SCIENCE AND ENGINEERINGH-index: 93

    CiteScore: 22.30
    CURRENT OPINION IN COLLOID & INTERFACE SCIENCEH-index: 131

    CiteScore: 16.50
    JOURNAL OF PHOTOCHEMISTRY AND PHOTOBIOLOGY A-CHEMISTRYH-index: 145

    CiteScore: 7.90
    Journal of Molecular StructureH-index: 89

    CiteScore: 7.10
    ChemCatChemH-index: 86

    CiteScore: 8.10
    學科內最受檢索的期刊 頁面查看次數
    JOURNAL OF COLLOID AND INTERFACE SCIENCE1409970
    ChemCatChem317650
    CATALYSIS COMMUNICATIONS264284
    JOURNAL OF PHYSICAL CHEMISTRY B245474
    Journal of Molecular Structure240855
    CATALYSIS LETTERS216291
    JOURNAL OF PHOTOCHEMISTRY AND PHOTOBIOLOGY A-CHEMISTRY171164
    JOURNAL OF MOLECULAR CATALYSIS A-CHEMICAL151805
    ADVANCES IN COLLOID AND INTERFACE SCIENCE141169
    ACTA PHYSICO-CHIMICA SINICA118085
  •  

    COLLOIDS AND SURFACES A-PHYSICOCHEMICAL AND ENGINEERING ASPECTS COLLOIDS AND SURFACES A-PHYSICOCHEMICAL AND ENGINEERING ASPECTS
    明年預測:
    穩步上升 無變化 逐步下降  刷新
  •  

     
  •  

     


首頁    上一頁    1    2    3    4    5    6    7    下一頁    末頁  (頁
/27)
  [COLLOIDS AND SURFACES A-PHYSICOCHEMICAL AND ENGINEERING ASPECTS] 的評論撰寫評論
作者: 牛乳局局长


領域: 地球科学
審稿時間: 0.0 month(s)
結果: 待定&不明


撰寫評論

2024-06-17 17:49:54 評論於
4.9 sub
4.11 under review   Invitation 2
4.15  Accept review 1   Complete review 1
6.10  Accept review 1   Complete review 1  send email to urge submission
6.17  Accept review 1   Complete review 1
Why not continue to invite since the reviewer has not agreed to review for two months?
Waiting is meaningless. There has been no progress in urging submission
(0) 讚! | 牛乳局局长

作者: 加油


領域: 材料科学
審稿時間: 1.0 month(s)
結果: 直接被接受


撰寫評論

2024-06-11 11:33:45 評論於
3.29 Submission
4.15 Major Revision
6.3 Major Revision Resubmission (requested extension for 1 month)
6.6 Minor Revision
6.8 Minor Revision Resubmission
6.10 Acceptance
Thank you to editor Katsuhiko Ariga, very nice, response very fast
(2) 讚! | 加油

作者: ioioioioio


領域: 工程技术
審稿時間: 0.0 month(s)
結果: 待定&不明


撰寫評論

2024-06-06 15:54:15 評論於
My situation is similar to yours, we are probably assigned to the same editor. This editor works too slowly, it's really frustrating
(0) 讚! | ioioioioio

作者: 不知先生


領域: 工程技术
審稿時間: 0.0 month(s)
結果: 待定&不明


撰寫評論

2024-06-06 15:27:59 評論於
Have you sent a reminder? It's almost been half a year, and I reminded once in the middle. The editor added another reviewer, but it's been almost two months again and the reviewer hasn't even started reviewing. It's such a waste of time
(1) 讚! | 不知先生

作者: kb24


領域: 工程技术
審稿時間: 0.0 month(s)
結果: 待定&不明


撰寫評論

2024-06-05 17:10:24 評論於
Submitted on April 26, 2024
With editor on April 28, 2024
A reminder was sent on May 28, 2024, but still no response from the editor (selected 'with editor' when submitting). The status of the article remains 'with editor' as of April 28, 2024. I have no energy to complain anymore. This is really taking advantage of others. I will definitely not submit to this journal next time
(0) 讚! | kb24

作者: 十年111


領域: 工程技术
審稿時間: 4.0 month(s)
結果: 待定&不明


撰寫評論

2024-06-05 09:21:14 評論於
Brother, did you make any major or minor revisions? Did the second review decide without sending it to the editor?
(0) 讚! | 十年111

作者: 月创醉天


領域: 材料科学
審稿時間: 1.0 month(s)
結果: 修改後接受


撰寫評論

2024-06-03 14:03:07 評論於
2024.01.03 Submission;
2024.01.08 Assigned to Editor Shuo Bai, very nice;
2024.01.22 External review returned;
2024.02.11 Revised;
2024.02.11 Accepted.
Quality control is good, there is room for improvement, and the factors will increase
(0) 讚! | 月创醉天

作者: searchpaper


領域: 环境科学与生态学
審稿時間: 0.0 month(s)
結果: 待定&不明


撰寫評論

2024-06-03 09:22:59 評論於
6.3, still with editor
(0) 讚! | searchpaper

作者: hxzhicheng


領域: 材料科学
審稿時間: 1.0 month(s)
結果: 修改後接受


撰寫評論

2024-05-31 17:54:33 評論於
Submitted from ASS, on 3.29 received first round of comments on 4.22, with 1 rejection and 3 revisions. The revisions provided by the editor, two reviewers raised similar questions. Returned for revision on 5.10, resubmitted on 5.23 (R2). One reviewer suggested further improvement in the quality of the article. Resubmitted on 5.27 and accepted on 5.31. The whole process took two months from submission to acceptance. Special thanks to Professor Bai Shuo for selecting this manuscript
(0) 讚! | hxzhicheng

作者: ioioioioio


領域: 工程技术
審稿時間: 0.0 month(s)
結果: 待定&不明


撰寫評論

2024-05-30 20:13:43 評論於
It has been under review for nearly five months, unbelievably slow
(0) 讚! | ioioioioio

作者: lark1532


領域: 工程技术
審稿時間: 0.0 month(s)
結果: 待定&不明


撰寫評論

2024-05-30 16:07:26 評論於
Have you sent for external audit? What are the specific reasons?
(0) 讚! | lark1532

作者: searchpaper


領域: 环境科学与生态学
審稿時間: 0.0 month(s)
結果: 待定&不明


撰寫評論

2024-05-30 13:59:59 評論於
Submitted on May 13; with editor on May 14
Now it's May 30; still with editor

This journal is so slow! Think twice before submitting
(0) 讚! | searchpaper

作者: zhoumu


領域: 化学
審稿時間: 0.0 month(s)
結果: 待定&不明


撰寫評論

2024-05-22 15:23:47 評論於
The selected edit is not correct, right?
(0) 讚! | zhoumu

作者: 努力的小小少年


領域: 工程技术
審稿時間: 0.0 month(s)
結果: 待定&不明


撰寫評論

2024-05-22 09:18:55 評論於
I have also been submitting for a long time, and now it's taking longer for the editors to review before witheditor. Why is it so slow recently?
(0) 讚! | 努力的小小少年

作者: 十年111


領域: 综合性期刊
審稿時間: 1.0 month(s)
結果: 修改後接受


撰寫評論

2024-05-21 16:39:22 評論於
It's okay, I completed three reviews in one week, and I will have the revisions ready by the 19th
(0) 讚! | 十年111

作者: xiao tang


領域: 环境科学与生态学
審稿時間: 0.0 month(s)
結果: 待定&不明


撰寫評論

2024-05-21 16:13:29 評論於
Please translate the following paragraph into English and Japanese, and title them as ":" and "
(0) 讚! | xiao tang

作者: xiao tang


領域: 环境科学与生态学
審稿時間: 0.0 month(s)
結果: 待定&不明


撰寫評論

2024-05-21 16:11:37 評論於
Please translate the following paragraph into English and Japanese
(0) 讚! | xiao tang

作者: 独家记忆


領域: 材料科学
審稿時間: 0.0 month(s)
結果: 待定&不明


撰寫評論

2024-05-17 15:47:42 評論於
20240428 submit
20240430 with editor
20240517 with editor
It's been over half a month and it's still with the editor, the review process is indeed very slow
(0) 讚! | 独家记忆

作者: xiao tang


領域: 环境科学与生态学
審稿時間: 0.0 month(s)
結果: 待定&不明


撰寫評論

2024-05-14 10:52:37 評論於
Can I use antibiotics to remove white spot algae?
(0) 讚! | xiao tang

作者: xiao tang


領域: 环境科学与生态学
審稿時間: 0.0 month(s)
結果: 待定&不明


撰寫評論

2024-05-14 10:51:26 評論於
Not yet invested
(0) 讚! | xiao tang

作者: dqwfqf


領域: 工程技术
審稿時間: 0.0 month(s)
結果: 待定&不明


撰寫評論

2024-05-13 16:54:59 評論於
Weixin AISWEI official account
(0) 讚! | dqwfqf

作者: dqwfqf


領域: 工程技术
審稿時間: 0.0 month(s)
結果: 待定&不明


撰寫評論

2024-05-13 10:13:30 評論於
I am as confused as you are
(0) 讚! | dqwfqf

作者: 小花花a


領域: 化学
審稿時間: 0.0 month(s)
結果: 待定&不明


撰寫評論

2024-05-13 00:45:27 評論於
It's been over four months now, and there is only one reviewer who has completed the review. I feel frustrated. I chose that editor at that time, and it turns out it was not a good choice as I heard people say
(0) 讚! | 小花花a

作者: jjzlw


領域: 工程技术
審稿時間: 0.0 month(s)
結果: 待定&不明


撰寫評論

2024-05-11 10:03:16 評論於
Record the submission
(0) 讚! | jjzlw

作者: iiiiiiii


領域: 化学
審稿時間: 0.0 month(s)
結果: 待定&不明


撰寫評論

2024-05-09 13:36:33 評論於
What's going on with this journal? It's been five months since submission and it's still under review
(0) 讚! | iiiiiiii

首頁    上一頁    1    2    3    4    5    6    7    下一頁    末頁  (頁
/27)

開始撰寫 [COLLOIDS AND SURFACES A-PHYSICOCHEMICAL AND ENGINEERING ASPECTS] 的評論:





Contact us

Contact us  

Your name*

Your email*

Your message*

Please fill in all fields and provide a valid email.

Security Code*